Sensor and control systems for food preparation

ABSTRACT

A temperature-regulating unit includes a base, a resonant tank, and a controller. The base is configured to support a pan. The resonant tank includes a coil and a capacitor. The resonant tank has a resonant frequency that is affected by a material of the pan and a temperature of the pan. The controller is configured to receive a temperature setting, monitor the resonant frequency, determine the material of the pan based on the resonant frequency, determine the temperature of the pan based on the resonant frequency, and adaptively control a thermal element based on the temperature of the pan, the material of the pan, and the temperature setting.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application (a) is a continuation of U.S. patent application Ser.No. 16/416,124, filed May 17, 2019, which claims the benefit of andpriority to (i) U.S. Provisional Patent Application No. 62/673,763,filed May 18, 2018, (ii) U.S. Provisional Patent Application No.62/673,768, filed May 18, 2018, (iii) U.S. Provisional PatentApplication No. 62/673,778, filed May 18, 2018, and (iv) U.S.Provisional Patent Application No. 62/673,780, filed May 18, 2018, and(b) is related to (i) U.S. patent application Ser. No. 16/415,938, filedMay 17, 2019, which claims the benefit of U.S. Provisional PatentApplication No. 62/673,762, filed May 18, 2018, (ii) U.S. patentapplication Ser. No. 16/415,943, filed May 17, 2019, which claims thebenefit of U.S. Provisional Patent Application No. 62/673,781, filed May18, 2018, and U.S. Provisional Patent Application No. 62/673,785, filedMay 18, 2018, and (iii) U.S. patent application Ser. No. 16/416,111,filed May 17, 2019, which claims the benefit of U.S. Provisional PatentApplication No. 62/673,769, filed May 18, 2018, U.S. Provisional PatentApplication No. 62/673,772, filed May 18, 2018, and U.S. ProvisionalPatent Application No. 62/673,775, filed May 18, 2018, all of which areincorporated herein by reference in their entireties.

BACKGROUND

Temperature feedback when preparing food can provide for a bettercooking experience, as well as improve the taste, quality, and enjoymentof the food. Traditional temperature feedback systems usetemperature-sensing mechanisms that require direct contact with the foodor the pan in which the food is being prepared or stored. However,contact-type sensing mechanisms may not make sufficient contact with thepan and can be easily damaged during use.

SUMMARY

One embodiment relates to a temperature-regulating unit. Thetemperature-regulating unit includes a base, a resonant tank, and acontroller. The base is configured to support a pan. The resonant tankincludes a coil and a capacitor. The resonant tank has a resonantfrequency that is affected by a material of the pan and a temperature ofthe pan. The controller is configured to receive a temperature setting,monitor the resonant frequency, determine the material of the pan basedon the resonant frequency, determine the temperature of the pan based onthe resonant frequency, and adaptively control a thermal element basedon the temperature of the pan, the material of the pan, and thetemperature setting.

Another embodiment relates to a temperature-regulating unit. Thetemperature-regulating unit includes a base, a resonant tank, and acontroller. The base is configured to support a pan. The resonant tankis positioned within the base. The resonant tank includes an inductiveheating coil and a capacitor. The inductive heating coil is positionedto thermally regulate the pan. The resonant tank has a resonantfrequency that is affected by a material of the pan and a temperature ofthe pan. The controller is configured to receive a temperature setting,monitor the resonant frequency of the resonant tank, and adaptivelycontrol the inductive heating coil based on the resonant frequency andthe temperature setting.

Still another embodiment relates to a temperature-regulating unit. Thetemperature-regulating unit includes a base, a resonant tank positionedwithin the base, a trivet that is selectively positionable between asurface of the base and a pan, and a controller. The resonant tankincludes a coil and a capacitor. The trivet is configured to insulatethe surface from the pan. A resonant frequency of the resonant tank isaffected by a presence of the trivet and a position of the trivetrelative to a central axis of the coil. The controller is configured todetect the presence of the trivet, detect the position of the trivetrelative to the central axis of the coil, and provide at least one of avisual indication or an audible indication to a user to assist the userin centering the trivet relative to the central axis of the coil.

This summary is illustrative only and is not intended to be in any waylimiting. Other aspects, inventive features, and advantages of thedevices or processes described herein will become apparent in thedetailed description set forth herein, taken in conjunction with theaccompanying figures, wherein like reference numerals refer to likeelements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-3 are various views of a temperature-regulating unit having acontactless inductive sensing and control system, according to variousexemplary embodiments.

FIG. 4 shows various view of a trivet of the temperature-regulating unitof FIG. 3 , according to an exemplary embodiment.

FIG. 5 is a schematic diagram of the contactless inductive sensing andcontrol system of the temperature-regulating units of FIGS. 1-3 ,according to an exemplary embodiment.

FIG. 6 is a schematic diagram of the contactless inductive sensing andcontrol system of the temperature-regulating units of FIGS. 1-3 ,according to another exemplary embodiment.

FIG. 7 is a graph depicting a change in a frequency sensed by acontactless inductive sensing assembly in response to a change inmaterial and temperature of a target item, according to an exemplaryembodiment.

FIGS. 8-10 show a method for controlling a temperature-regulating unitbased on data acquired by an inductive sensing assembly, according to anexemplary embodiment.

FIGS. 11-15 are various views of a multi-zone temperature sensing probesystem, according to various exemplary embodiments.

FIG. 16 is a method for controlling a temperature-regulating systembased on data acquired by a multi-zone temperature sensing probe,according to an exemplary embodiment.

FIGS. 17-20 are various views of a temperature-regulating unit having acontactless infrared sensing and control system, according to variousexemplary embodiments.

FIG. 21 is shows a detection array of the contactless infrared sensingand control system of FIGS. 17-20 , according to an exemplaryembodiment.

DETAILED DESCRIPTION

Before turning to the figures, which illustrate certain exemplaryembodiments in detail, it should be understood that the presentdisclosure is not limited to the details or methodology set forth in thedescription or illustrated in the figures. It should also be understoodthat the terminology used herein is for the purpose of description onlyand should not be regarded as limiting.

Contactless Inductive Sensing and Control System

According to the exemplary embodiments shown in FIGS. 1-3 , atemperature-regulating system, shown as temperature-regulating unit 10,includes a contactless sensing and control system, shown as inductivesensing and control system 100. As shown FIGS. 1-3 , thetemperature-regulating unit 10 includes a base or enclosure, shown ashousing 20, that defines an interior chamber, shown as internal cavity22, that receives the inductive sensing and control system 100.

As shown in FIGS. 1-3 , the temperature-regulating unit 10 is configuredto receive, hold, or otherwise support an item of cookware (e.g., atray, a pan, a pot, etc.), shown as pan 30. In various embodiments(e.g., embodiments where the temperature-regulating unit 10 includesinductive thermal elements, etc.), the pan 30 is an electricallyconductive and/or magnetic pan manufactured from a material such as castiron, carbon steel, magnetic stainless steel, and/or any other materialsuitable for use with an induction heating system. In other embodiments(e.g., embodiments where the temperature-regulating unit 10 includesnon-inductive thermal elements, etc.), the pan 30 is manufactured from anon-electrically conductive or non-magnetic material such as ceramics,porcelain, non-magnetic metals, etc. According to the exemplaryembodiment shown in FIG. 1 , the temperature-regulating unit 10 isconfigured a hot and/or cold well that receives and recesses the pan 30within the internal cavity 22 of the housing 20. According to theexemplary embodiment shown in FIG. 2 , the temperature-regulating unit10 is configured a soup well that receives and recesses the pan 30within the internal cavity 22 of the housing 20.

According to the exemplary embodiment shown in FIG. 3 , thetemperature-regulating unit 10 is configured as a surfacetemperature-regulating unit (e.g., an induction range, a cooktop, acooling countertop, etc.). As shown in FIG. 3 , thetemperature-regulating unit 10 includes a support surface (e.g., acooktop, a cooling plate, etc.), shown as countertop 40, having a firstsurface, shown as top surface 42, and an opposing second surface, shownas bottom surface 44. In one embodiment, the countertop 40 ismanufactured from a stone or other decorative finishing material (e.g.,granite, marble, quartz, wood, etc.). In other embodiments, thecountertop 40 is manufactured from a ceramic material (e.g., ceramicglass, etc.). In still other embodiments, the countertop 40 ismanufactured from a metal or metal alloy (e.g., stainless steel, castiron, aluminum, copper, etc.). As shown in FIG. 3 , the housing 20 iscoupled to the bottom surface 44 of the countertop 40, enclosing theinternal cavity 22. In some embodiments, the housing 20 is releasablysecured to the bottom surface 44 of the countertop 40 (e.g., withfasteners, a detachable bracket, latches, etc.). In some embodiments,the housing 20 is adhesively secured to the bottom surface 44 of thecountertop 40.

As shown in FIG. 3 , the temperature-regulating unit 10 includes anintermediate insulator, shown as trivet 60, positioned along the topsurface 42 of the countertop 40 and the pan 30. As shown in FIG. 4 , thetrivet 60 includes a upper portion, shown as insulator 62, a lowerportion, shown as support 64, and an intermediate portion, shown astrivet identifier 66, disposed (e.g., sandwiched, etc.) between theinsulator 62 and the support 64. According to an exemplary embodiment,the trivet identifier 66 is manufactured from a material that (i) isdifferent than the material of the pan 30 and (ii) detectable andidentifiable by the inductive sensing and control system 100, as isdescribed in more detail herein. In some embodiments, the trivetidentifier 66 of the trivet 60 facilitates centering of the pan 30relative to a thermal element of the temperature-regulating unit 10 tofacilitate achieving maximum thermal efficiency, as is also described inmore detail herein.

According to an exemplary embodiment, the trivet 60 is positioned toinsulate and protect the countertop 40 from the high heat of the pan 30.By way of example, the trivet 60 may be positioned between the pan 30and the countertop 40 to prevent breaking, cracking, burning, and/orotherwise damaging the countertop 40 that may be caused from excessiveheat exposure (e.g., in embodiments where the countertop 40 ismanufactured from a decorative finishing material, etc.). In someembodiments, the temperature-regulating unit 10 does not include thetrivet 60 (e.g., in embodiments where the countertop 40 is manufacturedfrom a metal, metal alloy, ceramic material, etc.; in embodiments wherethe countertop 40 functions as a heating/cooling plate, etc.).

According to the exemplary embodiment shown in FIGS. 1-3 , thetemperature-regulating unit 10 is configured as a built-in appliance orother built-in temperature-regulating system (e.g., a stovetopappliance, built into a countertop, etc.). In other embodiments, thetemperature-regulating unit 10 is configured as a portable, tabletopappliance (e.g., a portable induction range, a portable cooktop, acrockpot, etc.). In some embodiments, the temperature-regulating unit 10is configured to heat or warm the pan 30 and/or food product usinginductive heating. In some embodiments, the temperature-regulating unit10 is configured to heat or warm the pan 30 and/or food product usingnon-inductive heating (e.g., conductive heating, convective heating,radiant heating, etc.). In some embodiments, the temperature-regulatingunit 10 is configured to cool the pan 30 and/or food product. In someembodiments, the temperature-regulating unit 10 is configured as a dualheating and cooling system capable of heating and cooling the pan 30and/or food product.

As shown in FIGS. 1-4, 5, and 6 , the inductive sensing and controlsystem 100 includes a temperature-regulating element, shown as thermalelement 110, a sensor system, shown as inductive sensing assembly 120,and a control system, shown as controller 150, coupled to the thermalelement 110 and the inductive sensing assembly 120. As shown in FIGS.1-3 , the thermal element 110 is configured to thermally regulate (e.g.,heat, cool, etc.) the pan 30. As shown in FIGS. 1 and 2 , the thermalelement 110 is positioned adjacent the pan 30. As shown in FIG. 3 , thethermal element 110 is separated from the pan 30 and positioned tothermally regulate the pan 30 through the countertop 40. In someembodiments, the thermal element 110 is additionally or alternativelyconfigured to thermally regulate the countertop 40. In some embodiments,the thermal element 110 is or includes one or more heating elements(e.g., conductive heating elements, resistance heating elements,conduits that carry a heated working fluid, inductive heating elements,inductive heating coils, etc.). In some embodiments, the thermal element110 is or includes one or more cooling elements (e.g., thermoelectriccoolers, conduits that carry a cooled working fluid, Peltier devices,etc.). In some embodiments, the thermal element 110 includes one or moreheating elements and one or more cooling elements. In some embodiments,the thermal element 110 is a dual functioning heating/cooling element(e.g., Peltier devices, conduits that carry a cooled or heated workingfluid, etc.).

As shown in FIGS. 1-3, 5, and 6 , the inductive sensing assembly 120includes one or more sensing elements, shown as sensing coils 122,positioned within the internal cavity 22 of the housing 20 and aprocessor, shown as sensor processor 124, coupled to the sensing coils122. As shown in FIGS. 1 and 2 , the sensing coils 122 are separate fromand independent of the thermal element 110. As shown in FIG. 3 , thethermal element 110 and the sensing coil 122 are one in the same (e.g.,an inductive heating coil that functions as both a heating element andthe sensing coil 122, etc.). In other embodiments (e.g., embodimentswhere inductive heating is not used, etc.), the thermal element 110 andthe sensing coil 122 in FIG. 3 are separate components.

As shown in FIGS. 5 and 6 , the inductive sensing assembly 120 includesa capacitor, shown as capacitor 126, positioned between each of thesensing coils 122 and the sensor processor 124. According to anexemplary embodiment, each set of sensing coils 122 and capacitors 126form a resonant tank. According to an exemplary embodiment, the resonanttank have an intrinsic resonant frequency. According to an exemplaryembodiment, the sensor processor 124 is configured to induce a currentinto the resonant tank and measure the resultant resonant frequency.According to an exemplary embodiment, such a process performed by thesensor processor 124 facilitates detecting (i) when a target object,shown as target 160, is proximate the sensing coil 122 and/or (ii) thetemperature of the target 160. According to an exemplary embodiment, thetarget 160 is manufactured from an electrically conductive and/ormagnetic material (e.g., cast iron, carbon steel, ferrous steel,non-ferrous steel, non-steel metals, etc.). As the target 160 ispositioned closer to the sensing coil 122 and/or the temperature of thetarget 160 changes, the resonant frequency of the sensing coil 122(i.e., the resonant tank) will change. According to an exemplaryembodiment, the sensor processor 124 is configured to monitor theresonant frequency of the resonant tank to facilitate (i) detecting thepresence of the target 160, (ii) detecting the position of the target160 relative to a central axis, shown as axis 128, of the sensing coil122, (iii) identifying the material of the target 160, and/or (iv)identifying the temperature of the target 160 (e.g., without touchingthe target 160, through the countertop 40, etc.). Accordingly, theinductive sensing assembly 120 is configured to facilitate detecting thepresence, position, material, and/or temperature of the pan 30 and/orthe trivet identifier 66.

The sensor processor 124 may be configured to continuously orperiodically measure the resonant frequency of the sensing coil 122 andprovides such information to controller 150. In practice, the frequencyof the sensing coil 122 varies based on the location of the target 160.For example, if the target 160 is outside of a detection range of thesensing coil 122, the sensor processor 124 may report a frequency valueequal to the intrinsic frequency of the sensing coil 122. If the target160 is within the detection range of the sensing coil 122, the frequencyof the sensing coil 122 will begin to change (e.g., increase, decrease,etc.). The change in frequency may be reported to the controller 150 bythe sensor processor 124, signaling that the target 160 has beendetected. The change in the measured frequency of the sensing coil 122may be a function of the proximity of the target 160 to the axis 128 ofthe sensing coil 122. As the target 160 is moved towards a position thatis aligned with the axis 128 of the sensing coil 122, the measuredfrequency will continue to change. Moreover, the size and/or material ofthe target 160 will also affect the frequency of the sensing coil 122.Accordingly, in addition to detecting the presence of the target 160(e.g, the pan 30, the trivet identifier 66, etc.), the controller 150may be configured to differentiate between different objects, such asbetween the trivet identifier 66 and the pan 30, as well as determinethe size and/or the material of the target 160.

Further, the frequency of the sensing coil 122 varies based on thetemperature of the target 160. Temperature feedback control isparticularly useful in the context of food serving lines, where the pan30 may need to be kept within a certain temperature range for foodsafety and/or quality. When the target 160 is present and beingtemperature controlled with the thermal element 110, the frequency ofthe sensing coil 122 will vary based on the change in the temperature ofthe target 160 (e.g., decrease as the temperature increases, etc.). Therelationship between the temperature of the target 160 and the frequencyof the sensing coil 122 may be stored in the controller 150 tofacilitate achieving accurate temperature feedback and control.

As shown in FIG. 7 , a graph 170 depicts various frequency/temperatureprofiles, shown as first frequency profile 172, second frequency profile174, and third frequency profile 176, for various different targets 160(e.g., pans 30, trivet identifiers 66, etc.). According to an exemplaryembodiment, the first frequency profile 172 represents the resonantfrequency of the resonant tank when the target 160 is manufactured fromaluminum and as the target 160 increases in temperature from 20° C. to90° C.; the second frequency profile 174 represents the resonantfrequency of the resonant tank when the target 160 is manufactured from300 series stainless steel and as the target 160 increases intemperature from 20° C. to 100° C.; and the third frequency profile 176represents the resonant frequency of the resonant tank when the target160 is manufactured from 400 series stainless steel and as the target160 increases in temperature from 20° C. to 90° C. Accordingly, theinductive sensing assembly 120 facilitates (i) detecting differentmaterials of the target 160 because the resonant frequency changes basedon the material and (ii) detecting the temperature of the target 160because the resonant frequency decreases as the temperature of thetarget 160 increases (or vice versa). While the graph 170 depictsfrequency/temperature profiles for aluminum, 300 series stainless steel,and 400 series stainless steel, it should be understood that theinductive sensing and control system 100 may be configured to detect andidentify the presence, position, material, and/or temperature of varioustargets 160 manufactured from various other electrically conductivematerials, magnetic materials, and/or still other materials (e.g., castiron, ferrous steels, non-ferrous steels, copper, aluminum, etc.).

According to an exemplary embodiment, the controller 150 is configuredto control the thermal element 110 based on the resonant frequencymeasurements acquired by the inductive sensing assembly 120. Furtherdetails regarding the functions of and operations performed by thecontroller 150 is provided herein with regards to FIGS. 8-10 .

The controller 150 may be implemented as a general-purpose processor, anapplication specific integrated circuit (ASIC), one or more fieldprogrammable gate arrays (FPGAs), a digital-signal-processor (DSP),circuits containing one or more processing components, circuitry forsupporting a microprocessor, a group of processing components, or othersuitable electronic processing components. The controller 150 mayinclude a processing circuit having a processor and a memory. Theprocessing circuit may include an ASIC, one or more FPGAs, a DSP,circuits containing one or more processing components, circuitry forsupporting a microprocessor, a group of processing components, or othersuitable electronic processing components. The processor may beconfigured to execute computer code stored in the memory to facilitatethe activities described herein. The memory may be any volatile ornon-volatile computer-readable storage medium capable of storing data orcomputer code relating to the activities described herein. The memorymay include computer code modules (e.g., executable code, object code,source code, script code, machine code, etc.) configured for executionby the processor.

Referring now to FIGS. 8-10 , a method 200 for controlling thetemperature-regulating unit 10 based on data acquired by the inductivesensing assembly 120 is shown, according to an exemplary embodiment. Atstep 202, the temperature-regulating unit 10 is powered on and/or atemperature setting is selected (e.g., by an operator using a userinterface of the temperature-regulating unit 10, etc.). Next, anoptional sub-method 204 (steps 206-216) may be performed (e.g., inembodiments where the temperature-regulating unit 10 includes the trivet60, etc.). At step 206, the controller 150 is configured to monitorfrequency values at the sensing coil 122 of the temperature-regulatingunit 10 (e.g., acquired by the sensor processor 124, etc.).

At step 208, the controller 150 is configured to determine if the pan 30is present based on the frequency values at the sensing coil 122 (e.g.,frequency values associated with the pan 30 at room temperature, etc.).If the pan 30 is detected (without the trivet 60), at step 210, thecontroller 150 is configured to (i) prevent the thermal element 110 frombeing activated (e.g., to prevent damage to the countertop 40, etc.)and/or (ii) provide an error notification (e.g., an audible message,illuminate a visual indicator, etc.) indicating that the pan 30 ispresent without the trivet 60. If the pan 30 is not detected, at step212, the controller 150 is configured to determine if the trivet 60 ispresent based on the frequency values at the sensing coil 122 (e.g.,frequency values associated with the trivet 60 at room temperature,etc.). If the controller 150 does not detect the trivet 60, thecontroller 150 is configured to return to step 206. If the controller150 detects the trivet 60, the controller 150 is configured to proceedto step 214.

At step 214, in response to detecting the trivet 60, the controller 150is configured to determine whether the trivet 60 is centered relative tothe axis 128 of the sensing coil 122. If the trivet 60 is not centeredabout the axis 128, the controller 150 is configured to proceed to step216. At step 216, the controller 150 is configured to provide feedbackto the user to center the trivet 60. In some embodiments, the controller150 is configured to control a visual indicator whose output informs theuser (e.g., via an alphanumeric output, progress-style indicator, etc.)of the proximity of the trivet 60 to the center of the sensing coil 122.In some embodiments, the controller 150 is configured to control aspeaker to provide an audible indication of the proximity of the trivet60 to the center of the sensing coil 122. Once the trivet 60 iscentered, the controller 150 is configured to proceed to step 218.

At step 218, the controller 150 is configured to monitor the frequencyvalues at the sensing coil 122 of the temperature-regulating unit 10(e.g., acquired by the sensor processor 124, etc.). At step 220, thecontroller 150 is configured to determine if the pan 30 is present basedon the frequency values at the sensing coil 122 (e.g., frequency valuesassociated with the pan 30 at room temperature, etc.). If the pan 30 isnot detected, the controller 150 is configured to return to step 218until the pan 30 is detected. If the pan 30 is detected (with the trivet60 or without the trivet 60), the controller 150 is configured toproceed to an optional sub-method 222 (steps 224-230). At step 224, thecontroller 150 is configured to determine the material composition ofthe pan 30 based on the frequency values at the sensing coil 122. By wayof example, the controller 150 may be configured to identify whether thepan 30 is manufactured from ferrous steel (e.g., cast iron, etc.),non-ferrous steel (e.g., carbon steel, stainless steel, etc.), ornon-steel materials (e.g., copper, aluminum, etc.). In some embodiments,the controller 150 is configured to identify subclasses within the threegroupings above. For example, for non-steel pans, the controller 150 maybe configured to distinguish between copper pans, aluminum pans, etc. Atsteps 226-230, the controller 150 is configured to update thetemperature setting based on the type of pan identified at step 224(e.g., to more accurately control the thermal element 110 and thereforethe temperature of the pan 30 based on the material composition thereof,etc.).

At step 232, the controller 150 is configured to activate the thermalelement 110 of the temperature-regulating unit 10 based on user inputs(e.g., the user selected temperature setting at step 202, etc.) and/orthe type of material of the pan 30 present (e.g., updated temperaturesetting determined using sub-method 222, etc.). At step 218, thecontroller 150 is configured to monitor the frequency values at thesensing coil 122 of the temperature-regulating unit 10 while the thermalelement 110 is active (e.g., heating the pan 30, cooling the pan 30,etc.). Monitoring the frequency values at the sensing coil 122facilitates monitoring the temperature change of the pan 30. At step236, the controller 150 is configured to determine if the frequencyvalue at the sensing coil 122 is less than (or alternatively, greaterthan) a threshold frequency value. By way of example, the thresholdfrequency value may correspond a maximum temperature (or alternatively,a minimum temperature) of the pan 30. If the frequency value has not yetreached the threshold frequency value, the controller 150 is configuredto return to step 232 and continue heating (or alternatively, cooling)the pan 30 with the thermal element 110. If the threshold frequencyvalue has been reached, at step 238, the controller 150 is configured todeactive the thermal element 110 to stop heating (or alternatively,cooling) the pan 30 until the frequency value increases (oralternatively, decreases). Accordingly, the frequency values at thesensing coil 122 facilitate (i) detecting the presence of the trivet 60,the position of the trivet 60 relative to the axis 128, the presence ofthe pan 30, the material composition of the pan 30, and/or thetemperature of the pan 30 and (ii) providing accurate temperaturecontrol of the pan 30 via the thermal element 110.

Multi-Zone Temperature Sensing Probe

According to the exemplary embodiments shown in FIGS. 11-15 , atemperature-regulating system, shown as temperature-regulating system300, includes a temperature sensing device, shown as temperature sensingprobe 310; a control system, shown as controller 330, coupled to thetemperature sensing probe 310; and a temperature-regulating element,shown as thermal element 340, positioned to thermally regulate atemperature of a food vessel (e.g., a pan, a pot, a warming pan, a soupwell, a heating plate, a cooling plate, etc.), shown as food container350, and/or a food product (e.g., liquids, solids, soup, stew, meat,etc.), shown as food product 352.

As shown in FIGS. 11-15 , the temperature sensing probe 310 includes anelongated body, shown as probe body 312, having a plurality oftemperature sensing elements, shown as temperature sensors 314,positioned within and/or along the length of the probe body 312.According to an exemplary embodiment, the probe body 312 is configuredto be immersed within or introduced into the food product 352 to acquiretemperature data regarding the food product 352. The temperature sensors314 may be or include thermistors, thermocouples, resistance temperaturedetection (RTD) sensors, negative temperature coefficient (NTC)thermistors, any other suitable temperature sensor, or any combinationthereof. According to an exemplary embodiment, the temperature sensors314 are spaced along the probe body 312 at various preselected positionsto facilitate detecting the temperature at various depths of the foodproduct 352 and, thereby, facilitate determining (i) a depth, level, orthickness of the food product 352 (e.g., within the food container 350,outside of a food container, etc.) and/or (ii) a temperature gradientacross the depth or thickness thereof.

As shown in FIGS. 12-14 , the temperature sensing probe 310 includes ahousing, shown as probe head 316, coupled to an end of probe body 312such that the probe body 312 extends from the probe head 316. The probehead 316 may be configured to function as a handle for a user tomanipulate the temperature sensing probe 310. According to the exemplaryembodiment shown in FIGS. 11-15 , the probe body 312 and the probe head316 are shaped like that of traditional temperature sensing probes. Inother embodiments, the probe body 312 and/or the probe head 316 areotherwise shaped. By way of example, the temperature sensing probe 310may be shaped like a cooking utensil such as a ladle, a spoon, a servingfork, etc. In some embodiments, the probe body 312 includes a stirringfin or blade that facilitates stirring or mixing the food product 352within the food container 350. In some embodiments, the temperaturesensing probe 310 does not include the probe head 316. In suchembodiments, probe body 312 may be directly coupled to (e.g., integratedinto, etc.) and/or selectively couplable to (e.g., detachable from,etc.) a lid or cover of the food container 350.

As shown in FIGS. 13 and 14 , the temperature sensing probe 310 includesan interface, shown as user interface 318, disposed along the probe head316. In other embodiments, the user interface 318 is a remote interfaceconnected to the temperature sensing probe 310 via a wired or wirelessconnection. According to an exemplary embodiment, the user interface 318includes a display configured to provide feedback to an operator. Forexample, the user interface 318 may provide feedback related to atemperature, a temperature gradient, a depth, and/or a thickness of thefood product 352. In some embodiments, the user interface 318facilitates providing instructions to the user (e.g., to adjust thetemperature of the thermal element 340, to stir or mix the food product352, to add an ingredient to the food product. In some embodiments, theuser interface 318 of the temperature sensing probe 310 includes inputdevices (e.g., buttons, touch screen, etc.) to facilitate providingcommands to the controller 330 (e.g., a timer, a temperature setting, afood type input, etc.). In other embodiments, the controller 330includes the display and/or the input devices.

As shown in FIG. 14 , the temperature sensing probe 310 includes awireless communications device, shown as wireless transmitter 320.According to an exemplary embodiment, the wireless transmitter 320 isconfigured to facilitate wirelessly transmitting (e.g., via Bluetooth,Wi-Fi, NFC, ZigBee, etc.) the temperature data acquired by thetemperature sensors 314 to the controller 330. As shown in FIG. 15 , thetemperature sensing probe 310 includes a connector, shown as wiredconnector 322, extending from the probe head 316 to the controller 330.In some embodiments, the wired connector 322 is detachable from theprobe head 316 and/or the controller 330. According to an exemplaryembodiment, the wired connector 322 is configured to facilitatetransmitting the temperature data acquired by the temperature sensors314 to the controller 330. While shown as independent components of thetemperature-regulating system 300, in some embodiments, the controller330 is integrated into the temperature sensing probe 310 (e.g., theprobe head 316, etc.).

In some embodiments, the thermal element 340 is configured as a heatingelement. In one embodiment, the heating element is configured as aninductive heating element (e.g., an inductive heating coil, etc.)positioned to facilitate cooking, heating, and/or warming the foodcontainer 350 and/or the food product 352 via inductive heating. Inother embodiments, the thermal element 340 is configured as anon-inductive heating element (e.g., a conductive heating coil, aradiant heater, etc.) positioned to facilitate cooking, heating, and/orwarming the food container 350 and/or the food product 352 viaconductive, radiant, and/or convective heating. In some embodiments, thethermal element 340 is additionally or alternatively configured ascooling element (e.g., a Peltier device, a thermoelectric cooler, etc.)positioned to facilitate cooling the food container 350 and/or the foodproduct 352 via conductive and/or convective cooling.

The controller 330 may be implemented as a general-purpose processor, anapplication specific integrated circuit (ASIC), one or more fieldprogrammable gate arrays (FPGAs), a digital-signal-processor (DSP),circuits containing one or more processing components, circuitry forsupporting a microprocessor, a group of processing components, or othersuitable electronic processing components. The controller 330 mayinclude a processing circuit having a processor and a memory. Theprocessing circuit may include an ASIC, one or more FPGAs, a DSP,circuits containing one or more processing components, circuitry forsupporting a microprocessor, a group of processing components, or othersuitable electronic processing components. The processor may beconfigured to execute computer code stored in the memory to facilitatethe activities described herein. The memory may be any volatile ornon-volatile computer-readable storage medium capable of storing data orcomputer code relating to the activities described herein. The memorymay include computer code modules (e.g., executable code, object code,source code, script code, machine code, etc.) configured for executionby the processor. In some embodiments, the controller 330 is integratedinto a user's portable device (e.g., laptop, tablet, smartphone, etc.)that runs an application associated with the temperature sensing probe310.

In some embodiments, the controller 330 is configured to determine alevel or depth of the food product 352 (e.g., liquid, soup, stew, etc.)within the food container 350 based on the temperature at each of thetemperature sensors 314 positioned along the length of the probe body312. By way of example, only a portion of the probe body 312 may beimmersed within the food product 352 such that one or more of thetemperature sensors 314 may be surrounded by the food product 352 andthe remaining temperature sensors 314 may not be surrounded by the foodproduct 352 (e.g., positioned above the food product 352, etc.). Thetemperature sensors 314 at an elevated temperature may indicate thatsuch sensors are within the food product 352 and the temperature sensors314 at a lower temperature may indicate that such sensors are above thefood product 352. Accordingly, the controller 330 may be configured todetermine the level or depth of the food product 352 based on a knownrelationship (e.g., distance, etc.) between the temperature sensors 314,a known length of the probe body 312, and/or the temperature at each ofthe temperature sensors 314.

In some embodiments, the controller 330 is configured to determine athickness of the food product 352 (e.g., meat, a roast, prime rib, etc.)based on the temperature at each of the temperature sensors 314positioned along the length of the probe body 312. Because the foodproduct 352 may have a temperature gradient therethrough, thetemperature sensors 314 positioned proximate the outer edges of the foodproduct 352 may be at an elevated temperature relative to thetemperature sensors 314 at the middle or interior of the food product352. Accordingly, the controller 330 may be configured to determine thethickness the food product 352 based on a known relationship (e.g.,distance, etc.) between the temperature sensors 314 and anidentification of which of the temperature sensors 314 are proximate theouter edges of the food product based on the temperature data (i.e.,determine the distance between the two temperature sensors associatedwith the outer edges of the food product 352).

According to an exemplary embodiment, the controller 330 is configuredto control operation of the thermal element 340 based on (i) usercommands provided by a user via the user interface 318 and/or (ii)sensor feedback signals received from temperature sensing probe 310(e.g., temperature measurements, etc.) to thermally regulate andmaintain the food container 350 and/or the food product 352 at a desiredtemperature. In some embodiments, the controller 330 is configured tocontrol the thermal element 340 based on the depth, level, or thicknessof the food product 352 and/or a temperature gradient of the foodproduct 352. By way of example, the controller 330 may be configured todeactivate the thermal element 340 in response to the temperature of thefood product 352 reaching a desired temperature (e.g., a desired servingtemperature; an amount cooked such as rare, medium, well-done, etc.;etc.). By way of another example, the controller 330 may be configuredto activate a portion of the thermal element 340 to increase or decreasea temperature along a portion of the food container 350 (e.g., toprevent hot spots or cold spots within the food container 350, etc.).

In some embodiments, the controller 330 is configured to providefeedback, commands, or instructions to the user based on the temperaturedata. By way of example, the controller 330 may be configured to providean instruction to the user (e.g., via the user interface 318, on adisplay of the controller 330, on a user's portable device, etc.) to mixthe food product 352 (e.g., in response to non-uniform temperaturedistribution within the food product 352, etc.). By way of anotherexample, the controller 330 may be configured to provide an instructionto the user to manually increase or decrease the temperature of thethermal element 340. By way of still another example, the controller 330may be configured to provide an instruction to the user to add aningredient to the food product 352 (e.g., adding an ingredient once acertain temperature is reached, because the additional ingredientrequires less cooking time, etc.).

Referring now to FIG. 16 , a method 400 for controlling atemperature-regulating system (e.g., the temperature-regulating system300, etc.) based on data acquired by a multi-zone temperature sensingprobe (e.g., the temperature sensing probe 310, etc.) is shown,according to an exemplary embodiment. At step 402, the multi-zonetemperature sensing probe is configured to acquire temperature dataregarding a temperature of a food product at multiple probe points witha plurality of temperature sensors (e.g., the temperature sensors 314,etc.) positioned along the multi-zone temperature sensing probe (e.g.,the probe body 312, etc.). At step 404, the multi-zone temperaturesensing probe is configured to transmit the temperature data at eachpoint to a controller (e.g., the controller 330, etc.). In someembodiments, the multi-zone temperature sensing probe transmits thetemperature data wirelessly (e.g., via the wireless transmitted 320,etc.) to the controller. In some embodiments, the multi-zone temperaturesensing probe transmits the temperature data to the controller via awired connection (e.g., the wired connector 322, etc.). In someembodiments, the controller is integrated into the multi-zonetemperature sensing probe.

At step 406, the controller is configured to analyze the temperature ateach probe point. At step 408, the controller is configured to determinedepth or level of the food product (e.g., within the food container 350,etc.) or a thickness of the food product based on the temperature ateach probe point. At step 408, the controller is configured to supplypower to a thermal element (e.g., the thermal element 340, etc.) basedon the depth, level, or thickness of the food product and/or atemperature gradient across the food product. In other embodiments, thecontroller provides feedback to a user to manually adjust thetemperature of the thermal element. At step 412, the controller isconfigured to display instructions (e.g., mix, adjust temperature, addingredients, etc.) and/or feedback (e.g., current temperature, food isready, etc.) to the user (e.g., on an independent display, on the userinterface 318, on a display of the controller, on a user's portabledevice, etc.).

Contactless Infrared Sensing and Control System

According to the exemplary embodiments shown in FIGS. 17-20 , atemperature-regulating system, shown as temperature-regulating unit 500,includes a contactless sensing system, shown as sensing system 520. Insome embodiments, the sensing system 520 is used with or in place of theinductive sensing assembly 120. As shown FIGS. 17-20 , thetemperature-regulating unit 500 includes a body, enclosure, or housing,shown as base 502; a support structure, shown as overhead support 504,extending from the base 502; one or more thermal elements, shown asthermal elements 508; and a control system, shown as controller 510,coupled to the thermal elements 508 and the sensing system 520. In someembodiments, the temperature-regulating unit 500 does not include theoverhead support 504.

As shown in FIGS. 17-20 , the base 502 of the temperature-regulatingunit 500 is configured to receive, hold, or otherwise support one ormore items of cookware (e.g., a tray, a pan, a pot, etc.), shown as pans530, and/or food product. In various embodiments (e.g., embodimentswhere the temperature-regulating unit 500 includes inductive thermalelements, etc.), the pan 530 is an electrically conductive and/ormagnetic pan manufactured from a material such as cast iron, carbonsteel, magnetic stainless steel, and/or any other material suitable foruse with an induction heating system. In other embodiments (e.g.,embodiments where the temperature-regulating unit 500 includesnon-inductive thermal elements, etc.), the pan 30 is manufactured from anon-electrically conductive or non-magnetic material such as ceramics,porcelain, non-magnetic metals, etc.

The temperature-regulating unit 500 may be configured as a hot and/orcold well, a soup well, a surface temperature-regulating unit (e.g., aninduction range, a cooktop, a cooling countertop, etc.), a radiantheating unit, and/or still other suitable temperature-regulating units.In some embodiments, the temperature-regulating unit 500 is configuredas a built-in appliance or other built-in temperature-regulating system(e.g., a stovetop appliance, an oven, a conveyor toaster, built into acountertop, etc.). In some embodiments, the temperature-regulating unit500 is configured to a standalone unit (e.g., a serving line unit, abuffet unit, a conveyor toaster, etc.) (see, e.g., FIGS. 17 and 18 ). Insome embodiments, the temperature-regulating unit 500 is configured as aportable, tabletop appliance (e.g., a portable induction range, aportable cooktop, a toaster oven, etc.) (see, e.g., FIG. 19 ).

As shown in FIGS. 17 and 19 , the temperature-regulating unit 500includes a radiant heat lamp, shown as heat lamp 506, coupled to theoverhead support 504 above the pans 530 and configured to house thethermal element 508. As shown in FIG. 18 , the thermal element 508 isdisposed within the base 502 and positioned beneath the pans 530. Insome embodiments, the thermal element 508 is or includes one or moreheating elements (e.g., conductive heating elements, resistance heatingelements, conduits that carry a heated working fluid, inductive heatingelements, inductive heating coils, etc.). In some embodiments, thethermal element 508 is or includes one or more cooling elements (e.g.,thermoelectric coolers, conduits that carry a cooled working fluid,Peltier devices, etc.). In some embodiments, the thermal element 508includes one or more heating elements and one or more cooling elements.In some embodiments, the thermal element 508 is a dual functioningheating/cooling element (e.g., Peltier devices, conduits that carry acooled or heated working fluid, etc.).

As shown in FIGS. 17-20 , the sensing system 520 can be variouslypositioned about the temperature-regulating unit 500, so long as thesensing system 520 has a line of sight to the pans 530 and/or the foodproduct. Specifically, the sensing system 520 may be coupled orpositioned along the base 502 and/or the overhead support 504. In someembodiments, the sensing system 520 includes a plurality of infrared(IR) sensors (e.g., IR detectors, IR scanners, etc.) and/or scanningdevices (e.g., photodetectors, cameras, etc.) configured to acquire dataregarding the pans 530 and/or the food product. In some embodiments, thesensing system 520 includes a single IR sensor and/or scanner configuredto acquire data regarding each of the pans 530 and/or the food product.As shown in FIG. 20 , the sensing system 520 includes a sensor support,shown as sensor post 522, that is coupled to the base 502 and elevatesthe sensing system 520 above the base 502. In some embodiments, thesensing system 520 is pivotable and/or otherwise movable relative to thesensor post 522. In some embodiments, the sensing system 520 is fixed.In some embodiments, the sensing system 520 is positioned behind awindow or see-through cover.

As shown in FIGS. 20 and 21 , the sensing system 520 is configured toacquire a data array, shown as data array 524, from a plurality oflocations of a pan 530 and/or from a plurality of pans 530. According toan exemplary embodiment, the data array 524 includes (i) radiationinformation regarding radiation reflected/emitted from the pans 530and/or the food product (i.e., which is indicative of the temperaturethereof) and/or (ii) identifying information regarding the type of foodproduct.

The controller 510 may be implemented as a general-purpose processor, anapplication specific integrated circuit (ASIC), one or more fieldprogrammable gate arrays (FPGAs), a digital-signal-processor (DSP),circuits containing one or more processing components, circuitry forsupporting a microprocessor, a group of processing components, or othersuitable electronic processing components. The controller 510 mayinclude a processing circuit having a processor and a memory. Theprocessing circuit may include an ASIC, one or more FPGAs, a DSP,circuits containing one or more processing components, circuitry forsupporting a microprocessor, a group of processing components, or othersuitable electronic processing components. The processor may beconfigured to execute computer code stored in the memory to facilitatethe activities described herein. The memory may be any volatile ornon-volatile computer-readable storage medium capable of storing data orcomputer code relating to the activities described herein. The memorymay include computer code modules (e.g., executable code, object code,source code, script code, machine code, etc.) configured for executionby the processor.

According to an exemplary embodiment, the controller 510 is configuredto control operation of the thermal elements 508 based on the sensordata acquired by the sensing system 520. By way of example, thecontroller 510 may be configured to adaptively control the settings ofthe thermal element 508 based on temperature data acquired by thesensing system 520 for optimum cooking, warming, and/or cooling of thepans 530 and/or the food product. The controller 510 may be configuredto monitor for hot and cold points (e.g., a temperature gradient acrossone or more pans 530) based on the data array 524. The controller 510may additionally or alternatively be configured to identify separatepans 530 based on the sensor data and independently control thetemperature at each pan 530 individually via the thermal elements 508,as necessary.

By way of another example, the controller 510 may be configured toadaptively control the settings of the thermal element 508 based onidentifying data acquired by the sensing system 520 regarding the typeof food product present. For example, based on the frequency of thelight waves received by the sensing system 520 (e.g., the photodetector,etc.), the controller 510 may be configured to determine the type offood product present (e.g., using a look up table that has been createdfrom previous testing, etc.).

By way of yet another example, the controller 510 may be configured toadaptively control the settings of the thermal element 508 based onwavelength data acquired by the sensing system 520. For example, bymeasuring the wavelengths that are bounced back off of the food products(not absorbed) (which may be used to determine the type of the foodproducts), the controller 510 may be configured to control or tune theoutput of the thermal element 508 to a wavelength that is effective withthe food type. Specifically, by knowing the spectrum/wavelengths of IRenergy that is shining down onto the food product by the thermal element508 (the “emitted wavelengths”) (e.g., measured by the sensing system520, determined by the controller 510 based on the settings of thethermal element 508, etc.), and by measuring the wavelengths that arereflected from the food product (the “reflected wavelengths”), thecontroller 510 can determine the wavelength absorbed by the food product(the “absorbed wavelengths”). Then, the controller 510 may be configuredto adjust the emitted wavelengths from the thermal element 508 to thatof the absorbed wavelengths (i.e., the wavelengths that are beingabsorbed by the food product), making the temperature-regulating unit500 more energy efficient.

As utilized herein, the terms “approximately,” “about,” “substantially”,and similar terms are intended to have a broad meaning in harmony withthe common and accepted usage by those of ordinary skill in the art towhich the subject matter of this disclosure pertains. It should beunderstood by those of skill in the art who review this disclosure thatthese terms are intended to allow a description of certain featuresdescribed and claimed without restricting the scope of these features tothe precise numerical ranges provided. Accordingly, these terms shouldbe interpreted as indicating that insubstantial or inconsequentialmodifications or alterations of the subject matter described and claimedare considered to be within the scope of the disclosure as recited inthe appended claims.

It should be noted that the term “exemplary” and variations thereof, asused herein to describe various embodiments, are intended to indicatethat such embodiments are possible examples, representations, orillustrations of possible embodiments (and such terms are not intendedto connote that such embodiments are necessarily extraordinary orsuperlative examples).

The term “coupled” and variations thereof, as used herein, means thejoining of two members directly or indirectly to one another. Suchjoining may be stationary (e.g., permanent or fixed) or moveable (e.g.,removable or releasable). Such joining may be achieved with the twomembers coupled directly to each other, with the two members coupled toeach other using a separate intervening member and any additionalintermediate members coupled with one another, or with the two memberscoupled to each other using an intervening member that is integrallyformed as a single unitary body with one of the two members. If“coupled” or variations thereof are modified by an additional term(e.g., directly coupled), the generic definition of “coupled” providedabove is modified by the plain language meaning of the additional term(e.g., “directly coupled” means the joining of two members without anyseparate intervening member), resulting in a narrower definition thanthe generic definition of “coupled” provided above. Such coupling may bemechanical, electrical, or fluidic.

References herein to the positions of elements (e.g., “top,” “bottom,”“above,” “below”) are merely used to describe the orientation of variouselements in the FIGURES. It should be noted that the orientation ofvarious elements may differ according to other exemplary embodiments,and that such variations are intended to be encompassed by the presentdisclosure.

The hardware and data processing components used to implement thevarious processes, operations, illustrative logics, logical blocks,modules and circuits described in connection with the embodimentsdisclosed herein may be implemented or performed with a general purposesingle- or multi-chip processor, a digital signal processor (DSP), anapplication specific integrated circuit (ASIC), a field programmablegate array (FPGA), or other programmable logic device, discrete gate ortransistor logic, discrete hardware components, or any combinationthereof designed to perform the functions described herein. A generalpurpose processor may be a microprocessor, or, any conventionalprocessor, controller, microcontroller, or state machine. A processoralso may be implemented as a combination of computing devices, such as acombination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other such configuration. In some embodiments, particularprocesses and methods may be performed by circuitry that is specific toa given function. The memory (e.g., memory, memory unit, storage device)may include one or more devices (e.g., RAM, ROM, Flash memory, hard diskstorage) for storing data and/or computer code for completing orfacilitating the various processes, layers and modules described in thepresent disclosure. The memory may be or include volatile memory ornon-volatile memory, and may include database components, object codecomponents, script components, or any other type of informationstructure for supporting the various activities and informationstructures described in the present disclosure. According to anexemplary embodiment, the memory is communicably connected to theprocessor via a processing circuit and includes computer code forexecuting (e.g., by the processing circuit or the processor) the one ormore processes described herein.

The present disclosure contemplates methods, systems, and programproducts on any machine-readable media for accomplishing variousoperations. The embodiments of the present disclosure may be implementedusing existing computer processors, or by a special purpose computerprocessor for an appropriate system, incorporated for this or anotherpurpose, or by a hardwired system. Embodiments within the scope of thepresent disclosure include program products comprising machine-readablemedia for carrying or having machine-executable instructions or datastructures stored thereon. Such machine-readable media can be anyavailable media that can be accessed by a general purpose or specialpurpose computer or other machine with a processor. By way of example,such machine-readable media can comprise RAM, ROM, EPROM, EEPROM, orother optical disk storage, magnetic disk storage or other magneticstorage devices, or any other medium which can be used to carry or storedesired program code in the form of machine-executable instructions ordata structures and which can be accessed by a general purpose orspecial purpose computer or other machine with a processor. Combinationsof the above are also included within the scope of machine-readablemedia. Machine-executable instructions include, for example,instructions and data that cause a general purpose computer, specialpurpose computer, or special purpose processing machines to perform acertain function or group of functions.

Although the figures and description may illustrate a specific order ofmethod steps, the order of such steps may differ from what is depictedand described, unless specified differently above. Also, two or moresteps may be performed concurrently or with partial concurrence, unlessspecified differently above. Such variation may depend, for example, onthe software and hardware systems chosen and on designer choice. Allsuch variations are within the scope of the disclosure. Likewise,software implementations of the described methods could be accomplishedwith standard programming techniques with rule-based logic and otherlogic to accomplish the various connection steps, processing steps,comparison steps, and decision steps.

It is important to note that the construction and arrangement of thetemperature-regulating unit 10, the temperature-regulating system 300,and the temperature-regulating unit 500 as shown in the variousexemplary embodiments is illustrative only. Additionally, any elementdisclosed in one embodiment may be incorporated or utilized with anyother embodiment disclosed herein. Although only one example of anelement from one embodiment that can be incorporated or utilized inanother embodiment has been described above, it should be appreciatedthat other elements of the various embodiments may be incorporated orutilized with any of the other embodiments disclosed herein.

1. A temperature-regulating unit comprising: a base configured to support a pan; a resonant tank including a coil and a capacitor, wherein the resonant tank has a resonant frequency that is affected by a material of the pan and a temperature of the pan; and a controller configured to: receive a temperature setting; monitor the resonant frequency; determine the material of the pan based on the resonant frequency; determine the temperature of the pan based on the resonant frequency; and adaptively control a thermal element based on the temperature of the pan, the material of the pan, and the temperature setting.
 2. The temperature-regulating unit of claim 1, further comprising the thermal element, wherein the thermal element is positioned to thermally regulate the pan, the thermal element including at least one of a heating element, a cooling element, or a dual functioning heating/cooling element.
 3. The temperature-regulating unit of claim 1, wherein the coil is an inductive heating coil that functions as the thermal element.
 4. The temperature-regulating unit of claim 1, further comprising a contactless sensing assembly including at least one of an infrared sensor or a scanning device, the contactless sensing assembly positioned on top of or elevated above the base to acquire sensor data regarding a food product within the pan.
 5. The temperature-regulating unit of claim 4, wherein the sensor data includes temperature data regarding a temperature of the food product, and the controller is configured to adaptively control the thermal element based on the temperature of the food product.
 6. The temperature-regulating unit of claim 4, wherein the sensor data includes identifying data regarding a type of the food product, and wherein the controller is configured to adaptively control the thermal element based on the type of the food product.
 7. The temperature-regulating unit of claim 4, wherein the sensor data includes temperature data regarding a temperature of the food product and identifying data regarding a type of the food product, and wherein the controller is configured to adaptively control the thermal element based on the temperature of the food product and the type of the food product.
 8. The temperature-regulating unit of claim 1, further comprising a trivet that is selectively positionable between a surface of the base and the pan, wherein the trivet is configured to insulate the surface from the pan, wherein the resonant frequency is affected by at least one of a presence of the trivet or a position of the trivet relative to a central axis of the coil.
 9. The temperature-regulating unit of claim 8, wherein the controller is configured to: detect whether the trivet is present; and prevent activation of the thermal element in response to the trivet not being detected.
 10. The temperature-regulating unit of claim 8, wherein the controller is configured to: detect the presence of the trivet; detect the position of the trivet relative to the central axis of the coil; and provide at least one of a visual indication or an audible indication to a user to assist the user in centering the trivet relative to the central axis of the coil.
 11. The temperature-regulating unit of claim 1, wherein the controller is configured to: monitor the resonant frequency to determine whether the pan is present; and prevent activation of the thermal element in response to determining that the pan is not present.
 12. A temperature-regulating unit comprising: a base configured to support a pan; a resonant tank positioned within the base, the resonant tank including an inductive heating coil and a capacitor, the inductive heating coil positioned to thermally regulate the pan, the resonant tank having a resonant frequency that is affected by a material of the pan and a temperature of the pan; and a controller configured to: receive a temperature setting; monitor the resonant frequency of the resonant tank; and adaptively control the inductive heating coil based on the resonant frequency and the temperature setting.
 13. The temperature-regulating unit of claim 12, wherein the controller is configured to: monitor the resonant frequency to determine whether the pan is present; and prevent activation of the inductive heating coil in response to determining that the pan is not present.
 14. The temperature-regulating unit of claim 12, wherein the controller is configured to: determine the material of the pan based on the resonant frequency; and update the temperature setting based on the material of the pan.
 15. The temperature-regulating unit of claim 12, further comprising a contactless sensing assembly positioned on top of or elevated above the base to acquire sensor data regarding a food product within the pan.
 16. The temperature-regulating unit of claim 15, wherein the contactless sensing assembly includes at least one of an infrared sensor or a scanning device.
 17. The temperature-regulating unit of claim 15, wherein the sensor data includes temperature data regarding a temperature of the food product, and the controller is configured to adaptively control the inductive heating coil based on the temperature of the food product.
 18. The temperature-regulating unit of claim 15, wherein the sensor data includes identifying data regarding a type of the food product, and wherein the controller is configured to adaptively control the inductive heating coil based on the type of the food product.
 19. A temperature-regulating unit comprising: a base; a resonant tank positioned within the base, the resonant tank including a coil and a capacitor; a trivet that is selectively positionable between a surface of the base and a pan, wherein the trivet is configured to insulate the surface from the pan, wherein a resonant frequency of the resonant tank is affected by a presence of the trivet and a position of the trivet relative to a central axis of the coil; and a controller configured to: detect the presence of the trivet; detect the position of the trivet relative to the central axis of the coil; and provide at least one of a visual indication or an audible indication to a user to assist the user in centering the trivet relative to the central axis of the coil.
 20. The temperature-regulating unit of claim 19, wherein the coil is an inductive heating coil positioned to thermally regulate the pan, and wherein the controller is configured to prevent heating of the pan with the inductive heating coil if the presence of the trivet is not detected. 